Процесът на електроплаване е от решаващо значение вПроизводство на борда на HDI
Electroplating is the process of depositing metal materials on the surface of insulating substrates for connecting electronic components and providing conductive pathways. This process requires strict control of electroplating parameters to ensure uniform and firm coating. If the electroplating quality is poor, it may lead to a decrease in the electrical performance of the circuit board, and even problems such as short circuits.
(10 слоя от първия ред HDI твърда гъвкава платка)
В производствения процес ще има и множество специални стъпки на процеса
For example, laser drilling, HDI boards no longer rely on traditional mechanical drilling, but use laser drilling technology. The drilling hole diameter is generally 3-5 ml (0.076-0.127mm), which can achieve higher wiring density. However, laser drilling technology requires high-precision equipment and strict process control, and even a slight Отклонението може да повлияе на качеството на слепите дупки .
In addition, the difficulty of manufacturing multi-stage HDI boards further increases. Taking a second-order HDI board as an example, it usually requires two presses and at least two laser drills. The second-order HDI board with eight layers may be laminated with 2-9 layers first, then laminated with 1 and 10 layers on the outer layer, and laser Пробит два пъти . Този многократно натискане и сондиране не само увеличава сложността на процеса, но също така увеличава трудността на подравняването, пробиването и медното покритие .